Microfluidic Devices: Precision Molded Silicone Gaskets for Lab-on-a-Chip.

Microfluidic Devices: Precision Molded Silicone Gaskets for Lab-on-a-Chip

Problem Statement

Microfluidic devices require silicone gaskets that maintain sealing integrity under repeated thermal cycling (up to 150°C) and exposure to aggressive solvents (e.g., DMSO, acetone). Compression set failure and chemical swelling degrade performance over time.

Material Science Analysis

Standard silicone elastomers (VMQ) fail due to low crosslink density and inadequate filler dispersion. High-performance liquid silicone rubber (LSR) succeeds due to its optimized polymer backbone and platinum-cure system. LSR offers superior thermal stability and chemical resistance, minimizing swelling and compression set.

Technical Specs

• Material: LSR (Liquid Silicone Rubber)
• Shore A Hardness: 50 ± 2
• Tensile Strength: 10 MPa
• Elongation at Break: 500%
• Temperature Range: -50°C to 200°C
• Compression Set: ≤ 10% (22 hrs @ 150°C)
• Chemical Resistance: Resistant to DMSO, acetone, and IPA

Technical Comparison

Parameter	LSR	VMQ	FKM
Temperature Range (°C)	-50 to 200	-60 to 180	-20 to 200
Compression Set (%)	≤ 10	≤ 25	≤ 15
Chemical Resistance	Excellent	Good	Excellent
Elongation at Break (%)	500	400	200

Standard Compliance

RubberQ's IATF 16949-certified process ensures batch-to-batch consistency. Our compounding adheres to ASTM D2000 for material callouts and ISO 3601 for sealing performance. Surface preparation and bonding meet ASTM D429 standards.

For custom material compound development or IATF 16949 documentation, consult RubberQ's engineering department.